PCB Layout and Design
for PCB Cooling Solutions
Many heat issues can be avoided or resolved when circuit board designs are optimized for thermal management. Optimizing PCBs for thermal management has been proven to ensure reliability, speed time to market and reduce overall costs.
ATS provides a range of PCB design services, from CFD studies on boards at the CAD stage to wind-tunnel testing of actual or dummy boards in conditions that simulate air distribution in actual applications.
ATS engineers can improve cooling airflow over populated boards and enhance natural airflow to individual hot components.
ATS is capable of characterizing boards using research-quality instruments, heat and air velocity sensors, and PCs. Working or dummy PCBs can be tested in isolation or as installed in their own packaging domain.
ATS can also perform computational simulations of customer-supplied designs using proprietary programs and computational fluid dynamics packages such as FLOTHERM and CFdesign.
Often, these studies head off more expensive cooling solutions by showing that minor changes to component layouts or to the volume of airflow will resolve thermal problems.