ATS-59003-C1-R0 32.00 x 50.00 x 12.00 mm BGA Heat Sink - High Performance Device Specific

*Image above is for illustration purpose only.	32.00 x 50.00 x 12.00 mm BGA Heat Sink - High Performance Device Specific - Freescale
	Part#:	ATS-59003-C1-R0
	Equivalent PN:	ATS-59003-C2-R0 Discontinued
	Description:	32.00 x 50.00 x 12.00 mm BGA Heat Sink - High Performance Device Specific - Freescale

	Component Specific:	N/A
	Heat Sink Type:	Freescale
	Heat Sink Attachment:	maxiGRIP
	Installation Guide:	Download PDF
	Thermal Performance:	See detail

Designed for flip-chip processors such as Freescale MPCs
maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
Comes preassembled with high performance, phase changing, thermal interface material

Part Number	Length (mm)	Width (mm)	Height (mm)	Fin Tip to Fin Tip (mm)	TIM	FINISH	Data Sheet	RoHS
ATS-59003-C1-R0	32.00	50.00	12.00	71.3	T766	BLACK-ANODIZED

Schematic Image	AIR VELOCITY		THERMAL RESISTANCE
Schematic Image	FT/MIN	M/S	°C/W Unducted Flow	°C/W Ducted Flow
*Image above is for illustration purpose only.	200	1.0	3.8	2.4
	300	1.5	3	N/A
	400	2.0	2.6	N/A
	500	2.5	2.3	N/A
	600	3.0	2.1	N/A
	700	3.5	2	N/A
	800	4.0	1.9	N/A

Length and width dimensions refer to the size of the component. Dimensions of the heat sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly
Thermal performance data are provided for reference only. Actual performance may vary by application
ATS reserves the right to update or change its products without notice to improve the design or performance
Additional tooling fees may be required
Typical lead time is a minimum of 4-6 weeks
Contact ATS to learn about custom options available

ATS-59003-C1-R0 32.00 x 50.00 x 12.00 mm BGA Heat Sink - High Performance Device Specific - Freescale
superGRIP™ Installation & Removal
superGRIP™ Clearance Guidelines
ATS-maxiGRIP Installation Guidelines
ATS-maxiGRIP Clearance Guidelines
RoHS Obtain RoHS Certificate

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