Heat Sinks Custom BGA Cooling Solutions w/ maxiGRIP™ Attachment ATS-59010-C1-R0
  • Designed for flip-chip processors such as Freescale MPCs
  • maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
  • Comes preassembled with high performance thermal interface material
 

Product Details

LENGTH WIDTH HEIGHT TIM FINISH
62 52 13 3M8815 BLACK-ANODIZED

Thermal Performance

AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow
200 1.0 3.2 1.8
300 1.5 2.6 N/A
400 2.0 2.1 N/A
500 2.5 1.9 N/A
600 3.0 1.7 N/A
700 3.5 1.5 N/A
800 4.0 1.4 N/A