Heat Sinks
 
 

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Heat Sinks High Performance BGA Cooling Solutions with maxiGRIP™ Attachment ATS-53170B-C1-R0
  • High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments.
  • maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
  • Designed specifically for BGA s and other surface mount packages
  • Meets Telcordia GR -63-Core Office Vibration, ETSI 300 019 Transportation Vibration, and MIL -ST D-810 Shock testing and Unpackaged Drop Testing standards
  • Comes preassembled with high performance, phase change, thermal interface material
 

Product Details

LENGTH WIDTH HEIGHT TIM FINISH
17 17 7.5 Chomerics T766 Blue

Thermal Performance

AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow
200 1.0 24.3 12.3
300 1.5 N/A
400 2.0 N/A
500 2.5 N/A
600 3.0 N/A
700 3.5 N/A
800 4.0 N/A

ATS-53170B-C1-R0

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1 1 $16.37
2 10 $7.89
3 50 $7.60
4 100 $6.58
5 500 $6.14
6 1000 $5.92
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8 5000 $5.39
9 10000 $5.31
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