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BGA Cooling Solutions w/ maxiGRIP™ Attachment
ATS-53170D-C2-R0
- High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
- Designed specifically for BGAs and other surface mount packages
- Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock Testing and Unpackaged Drop Testing standards
- Comes preassembled with high performance, phase changing, thermal interface material
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Product Details
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LENGTH
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WIDTH
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HEIGHT
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TIM
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FINISH
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17
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17
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9.5
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Saint-Gobain C1100F
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BLACK-ANODIZED
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