|
BGA Cooling Solutions w/ maxiGRIP™ Attachment
ATS-53230D-C2-R0
- High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
- Designed specifically for BGAs and other surface mount packages
- Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock Testing and Unpackaged Drop Testing standards
- Comes preassembled with high performance, phase changing, thermal interface material
|
|
|
Product Details
|
LENGTH
|
WIDTH
|
HEIGHT
|
TIM
|
FINISH
|
|
23
|
23
|
9.5
|
Saint-Gobain C1100F
|
BLACK-ANODIZED
|
|
|
|
|
|
|
|