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High Performance BGA Cooling Solutions with maxiGRIP™ Attachment
ATS-53230P-C1-R0
- High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments.
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
- Designed specifically for BGA s and other surface mount packages
- Meets Telcordia GR -63-Core Office Vibration, ETSI 300 019 Transportation Vibration, and MIL -ST D-810 Shock testing and Unpackaged Drop Testing standards
- Comes preassembled with high performance, phase change, thermal interface material
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Product Details
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LENGTH
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WIDTH
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HEIGHT
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TIM
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FINISH
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23
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23
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17.5
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Chomerics T766
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Blue
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ATS-53230P-C1-R0
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Items ships within 3-5 business days
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