Heat Sinks
 
 

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Heat Sinks High Performance BGA Cooling Solutions with maxiGRIP™ Attachment ATS-53350B-C1-R0
  • High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments.
  • maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
  • Designed specifically for BGA s and other surface mount packages
  • Meets Telcordia GR -63-Core Office Vibration, ETSI 300 019 Transportation Vibration, and MIL -ST D-810 Shock testing and Unpackaged Drop Testing standards
  • Comes preassembled with high performance, phase change, thermal interface material
 

Product Details

LENGTH WIDTH HEIGHT TIM FINISH
35 35 7.5 Chomerics T766 Blue

Thermal Performance

AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow
200 1.0 10.3 4.8
300 1.5 N/A
400 2.0 N/A
500 2.5 N/A
600 3.0 N/A
700 3.5 N/A
800 4.0 N/A

ATS-53350B-C1-R0

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S.NoQuantityUnit PriceBuy Now
1 1 $16.37
2 10 $8.72
3 50 $8.40
4 100 $7.27
5 500 $6.78
6 1000 $6.54
7 2500 $6.06
8 5000 $5.96
9 10000 $5.86
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