|
High Performance BGA Cooling Solutions with maxiGRIP™ Attachment
ATS-53425G-C1-R0
- High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments.
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
- Designed specifically for BGA s and other surface mount packages
- Meets Telcordia GR -63-Core Office Vibration, ETSI 300 019 Transportation Vibration, and MIL -ST D-810 Shock testing and Unpackaged Drop Testing standards
- Comes preassembled with high performance, phase change, thermal interface material
|
|
|
Product Details
|
LENGTH
|
WIDTH
|
HEIGHT
|
TIM
|
FINISH
|
|
42.5
|
42.5
|
12.5
|
Chomerics T766
|
Blue
|
|
|
ATS-53425G-C1-R0
|
Items ships within 3-5 business days
|
|
|
|
|
|