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maxiFLOW™ Heat Sink with maxiGRIP™Clip Attachment for Low Profile Components
ATS-51450R-C2-R0
- maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
- Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards
- Comes preassembled with high performance thermal interface material
- Designed for low profile components from 1.5 to 2.99mm
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Product Details
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LENGTH
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WIDTH
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HEIGHT
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TIM
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FINISH
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45
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45
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19.5
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Saint-Gobain C675
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BLACK- ANODIZED
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