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maxiFLOW/superGRIP
- Requires minimal space around the component’s perimeter; ideal for densely populated PCBs
- Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
- Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs
- Eliminates the need to drill mounting holes in the PCB
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maxiFLOW/maxiGRIP-STD
- maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
- Comes preassembled with high performance, phase changing, thermal interface material
- Designed for standard height components from 3 to 4.5mm
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maxiFLOW w/Thermal Tape
- maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
- Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight and keeps costs low
- Higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks
- Comes preassembled with high performance thermal tape
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