maxiFLOW/superGRIP

• Requires minimal space around the component’s perimeter; ideal for densely populated PCBs
• Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
• Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs
• Eliminates the need to drill mounting holes in the PCB

maxiFLOW/maxiGRIP-STD

• maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
• maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
• Comes preassembled with high performance, phase changing, thermal interface material
• Designed for standard height components from 3 to 4.5mm

 

maxiFLOW w/Thermal Tape

• maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
• Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight and keeps costs low
• Higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks
• Comes preassembled with high performance thermal tape