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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - December 2008

Current Issues

December 2008

  • Heat Transfer Analysis of Compact Heat Exchangers Using Standard Curves
  • Adiabatic Heat Transfer Coefficient in Thermal Analysis
  • Application of Dimensional Analysis in Thermal Management
  • Phase Change Materials for Transient Electronics Cooling