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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Heat Transfer Calculations of a Thermosyphon
  • Data Center Hybrid Cooling
  • Porous Heat Sinks
  • Phonons in Heat Transfer Devices
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Table of Contents - September 2008

Current Issues

September 2008

  • Direct Cooling of Power Modules by Using Microchannel Structures
  • When to Use Thermal Interface Materials and What Types
  • Thermal Analysis and Heat Sink Design for a High Performance PCI Card
  • Calculating Fluid Velocity in Natural Convection Applications