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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Measuring Heat Flux from a Component on a PCB
  • Design Parameters in Immersion Cooling
  • Basic Definition of Thermal Resistance
  • Cooling with Lasers
  • Mobile Device Thermal Management
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Table of Contents - September 2008

Current Issues

September 2008

  • Direct Cooling of Power Modules by Using Microchannel Structures
  • When to Use Thermal Interface Materials and What Types
  • Thermal Analysis and Heat Sink Design for a High Performance PCI Card
  • Calculating Fluid Velocity in Natural Convection Applications