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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Modeling Vapor Chambers as a Heat Spreading Device Using CFD
  • Application of TEC Using a Heat Exchanger for Sub-Ambient Liquid Cooling
  • Advanced Packaging Materials
  • Heat Exchangers Using Two-Phase Flow
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Table of Contents - November 2008

Current Issues

November 2008

  • Electrowetting with Liquid Alloys for Electronics Cooling
  • Estimating the Effect of Moist Air on Natural Convection Heat Transfer in Electronics Cooling
  • Choosing and Fabricating a Heat Sink Design
  • Surface Area Treatments for Enhancing Heat Transfer