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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - August 2008

Current Issues

August 2008

  • Pumped Two-Phase Loop for Electronics Cooling
  • How Heat Sink Height Affects Its Thermal Resistance
  • Decreasing Thermal Contact Resistance by Using Interface Materials
  • The Effect of Thermal Entry Regions on Heat Transfer