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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Modeling Vapor Chambers as a Heat Spreading Device Using CFD
  • Application of TEC Using a Heat Exchanger for Sub-Ambient Liquid Cooling
  • Advanced Packaging Materials
  • Heat Exchangers Using Two-Phase Flow
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Table of Contents - August 2008

Current Issues

August 2008

  • Pumped Two-Phase Loop for Electronics Cooling
  • How Heat Sink Height Affects Its Thermal Resistance
  • Decreasing Thermal Contact Resistance by Using Interface Materials
  • The Effect of Thermal Entry Regions on Heat Transfer