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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - October 2008

Current Issues

October 2008

  • Spray Cooling Thermal Management Technology for High Power Devices
  • How Air Velocity Affects the Thermal Peformance of Heat Sinks
  • The Limit of Heat Sink Thermal Resistance for a Ducted Flow
  • Boundary Layer Formation and Heat Transfer