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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Modeling Vapor Chambers as a Heat Spreading Device Using CFD
  • Application of TEC Using a Heat Exchanger for Sub-Ambient Liquid Cooling
  • Advanced Packaging Materials
  • Heat Exchangers Using Two-Phase Flow
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Table of Contents - July 2008

Current Issues

July 2008

  • Vapor Chamber and Solid Material as a Base for High Power Devices
  • Lumped System Heat Transfer Analysis
  • Heat Transfer Correlations in Thermal Management - Part 2
  • Heat Sink Attachment Options