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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Heat Transfer Calculations of a Thermosyphon
  • Data Center Hybrid Cooling
  • Porous Heat Sinks
  • Phonons in Heat Transfer Devices
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Table of Contents - April 2008

Current Issues

April 2008

  • Using Thermosiphons in Electronics Cooling
  • Integral Modeling of a Component
  • Air Cooling Studies in an ATCA Chassis
  • How Interface Materials are Tested