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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - November 2007

Current Issues

November 2007

  • Thermal Characteristics of Liquid Coolants for Liquid Loop Cooling
  • Human and Technical Factors in Upfront CFD Success
  • Using Flow Visualization for PCB Thermal Design and Optimization
  • Hydraulic Diameter: Definition and Role in Electronics Cooling
  • Cooling News