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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - August 2007

Current Issues

August 2007

  • Micro TECs for Spot Cooling of High Power Devices
  • The Effect of Compact PCB Layout on Thermal Management
  • Air Flow Measurement in Electronic Systems
  • Spreading Thermal Resistance; Its Definition and Control