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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - October 2007

Current Issues

October 2007

  • Closed Loop Liquid Cooling for High Power Electronics
  • ATCA and MicroTCA Chassis; Their Roles and Uses
  • Thermal Coupling with Different Modes of Heat Transfer from a Single Device
  • Understanding Radiation Heat Transfer