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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - January 2009

Current Issues

January 2009

The most January 2009 issue of Qpedia Thermal eMagazine is now available for download at www.qats.com/qpedia. As always, this month's issue includes four technical articles focused on the thermal management of electronic devices including:

 

» Chip Level Cooling: The Final Frontier

 

» Heat Sink Thermal Resistance as a Function of Height: Ducted Flow with Fan Curve

 

» Heat Sink Testing Methods and Common Oversights

 

» Conduction Heat Transfer and How it is Calculated