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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Modeling Vapor Chambers as a Heat Spreading Device Using CFD
  • Application of TEC Using a Heat Exchanger for Sub-Ambient Liquid Cooling
  • Advanced Packaging Materials
  • Heat Exchangers Using Two-Phase Flow
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Table of Contents - January 2009

Current Issues

January 2009

The most January 2009 issue of Qpedia Thermal eMagazine is now available for download at www.qats.com/qpedia. As always, this month's issue includes four technical articles focused on the thermal management of electronic devices including:


» Chip Level Cooling: The Final Frontier


» Heat Sink Thermal Resistance as a Function of Height: Ducted Flow with Fan Curve


» Heat Sink Testing Methods and Common Oversights


» Conduction Heat Transfer and How it is Calculated