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The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

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Table of Contents - April 2009

Current Issues

April 2009

The High Cost of Cooling a Data Center

Greater numbers of servers and higher component power densities are taking cooling issues to a critical point. To keep components below their maximum junction temperatures requires more energy and technical expertise. When energy was cheaper, there was less concern about its future costs. Cooling a data center was achieved simply by lowering the ambient temperature using an air conditioning system. Facing today’s energy costs, this can be a costly tactic.


The Basic Principles of Wind Tunnel Design

Wind tunnels generate uniform air flows, with low turbulence intensity, for thermal and hydraulic testing. These devices have been around for more than a century, and are used in many industries, including aerospace, automotive, and defense. They also play a key role in electronics thermal management.


How Baffles and Plenumns Affect Fan Performance

In today’s electronics, there is a constant push for more functionality in smaller volumes. While the dissipated power per device gate is decreasing, more and more functions are being squeezed into a smaller volume. ICs and ASICs are getting more powerful and their thermal load per volume is increasing. To thermally manage these components, forced convection cooling is the most common method, along with the use of efficient heat sinks.


Liquid Cooling Systems and Their Components

In its most basic form, the purpose of a liquid cooling system is to transport heat from a device to a remote heat exchanger. With the ongoing increase in power dissipation, and tightening restriction on packaging, the need for more sophisticated and compact liquid cooling systems is clear. This paper will describe the classic setup of a liquid cooled loop, as well as several examples of novel designs.