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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Measuring Heat Flux from a Component on a PCB
  • Design Parameters in Immersion Cooling
  • Basic Definition of Thermal Resistance
  • Cooling with Lasers
  • Mobile Device Thermal Management
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Table of Contents - June 2009

Current Issues

June 2009

3D Packaging and the Need for Chip Level Modeling
Consumer demand for increased mobility, wireless connectivity and advanced features has led to a variety of new products, including PDAs, digital cameras and MP4 players. Mobile phones, as we know them today, have evolved from big handsets with basic calling uses into small, multi-functional phones for the palm of your hand. The versatility of these little phones is amazing. To enable this kind of functionality, there is a strong need for powerful, reliable computing and high volume data storage in very limited space.


Boundary Conditions for Natural Convection CFD Simulations
A critical part of the computational fluid dynamics (CFD) simulation process is creating boundary conditions. These are applied at the start of the simulation, and directly affect the end result. This article discusses the various boundary conditions needed for different natural convection CFD conditions.

Calculating the Loads for Liquid Cooling Systems
When exploring the use of liquid cooling for thermal management, calculations are needed to predict its performance. This article presents basic equations for liquid cooling and provides numerical examples on how to calculate the loads in a typical liquid cooling system.


Heat Flux Gauges: What They Are and What They Do
Heat flux sensors are used to measure the rate of heat flow in many applications. Examples include heat flow measurements through walls, human skin (diagnostics), clothing (insulation testing) and soils (water evaporation). Heat flux sensors can also measure the heat dissipation from electronic components, and are used in instruments to measure gas flow and the thermal conductivity of gases, liquids and solids.