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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Measuring Heat Flux from a Component on a PCB
  • Design Parameters in Immersion Cooling
  • Basic Definition of Thermal Resistance
  • Cooling with Lasers
  • Mobile Device Thermal Management
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Table of Contents - October 2009

Current Issues

October 2009

Synthetic Jets Air Cooling: Air Cooling with High Local Heat Transfer Coefficient
As today’s electronics generate more heat inside ever smaller spaces, engineers are challenged to find new ways to effectively cool the components. In this article, we discuss synthetic jets, an air cooling technology that can provide a high local heat transfer coefficient at a low flow rate with low acoustics and high reliability.


Heat Flux Measurement: Practical Applications for Electronics
Heat flux sensors are practical measurement tools which are useful for determining the amount of thermal energy passed through a specific area per unit of time. Measuring heat flux can be useful, for example, in determining the amount of heat passed through a wall or through a human body, or the amount of transferred solar or laser radiant energy to a given area. This article highlights several practical uses of the heat flux sensor in the design of electronics systems.


Hydrodynamic & Thermal Entry Length Correlations for Turbulent Flow in a Cylindrical Tube 
The study of fluid flow in tubes is an important topic in engineering, as it occurs frequently in practice, especially in the design of heat exchanger equipment. Of particular importance to the design engineer is an understanding of the hydrodynamic and thermal entry length correlations for cylindrical tubes (the most common profile). We will examine each of these issues in turn.


Cooling Electronics Enclosures
The telecommunications industry installs electronic components inside many types of enclosures. They come in sealed and vented forms and use active cooling or passive cooling methods. Until recently, the thermal management performance of basic enclosures was sufficient to meet the industry requirements. But with today’s rising component power and increased board density, the need for upfront thermal management planning is critical in telecom enclosures.


Cooling News
Product, Service and Event Announcement from Around the Industry