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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Measuring Heat Flux from a Component on a PCB
  • Design Parameters in Immersion Cooling
  • Basic Definition of Thermal Resistance
  • Cooling with Lasers
  • Mobile Device Thermal Management
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Table of Contents - November 2009

Current Issues

November 2009

Natural Convection in Vertical Channels

In contrast with airflow generated by the mechanical working of a prime air mover, natural convection results from the buoyancy forces generated by the ambient air being heated by a heat source. Air adjacent to the heat source absorbs heat from the surface, becomes hotter than the surrounding air, and rises due to density differences.


Thermal Issues in Stacked Die Packages

High performance package manufacturers are migrating to stacked die packages. This stacking can be done either laterally or vertically. The most common way to increase memory and support complex functions is to pack more chips on top of each other in a package. In a stacked version, this increases the density of IC elements and the Moore’s law can still be applied.


Heat Sink Transient Response

In general, heat sink response time is closely related to its material properties and to convection heat transfer from its surface. In this article, the transient response of aluminum and copper heat sinks under different heat flux and flow conditions is studied numerically.


General Methods for Measuring Thermal Conductivity

This article provides an overview of the principal methods for measuring thermal conductivity, particularly in electronics thermal management. Designing successful electronics cooling solutions requires an accurate knowledge of the thermal and mechanical properties of the various materials involved.


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Product, Service and Event Announcements from Around the Industry