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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - February 2010

Current Issues

February 2010

Features

Fundamentals of Magnetofluiddynamic Pumps

The thermal conductivity of liquid metals can be orders of magnitude greater than water, glycol or engineered dielectric fluids. This means an equivalent amount of cooling can be performed using much less mass flow rate. The requirements for pumping and pressure heads are reduced, which in turn can increase reliability.

An Approach for Compact Heat Sink Modeling

This article discusses the methodology of compact heat sink modeling. It first provides some modeling background, then compares detailed, substitute and compact modeling. It shows how these modeling results correlate with experimental data.

Case Study: Cabinet Cooling Using a Water and Refrigeration System

In the past, designers tried rack cooling methods such as cabinets with better airflow configurations, adding central air conditioning systems, raising floors and using cold-aisle and hot-aisle layouts. Today, engineers are turning their attention to water-cooled techniques and refrigeration technology to solve cabinet overheating problems.

Using the Sterling Cycle for Cooling and Power Generations

For many years a shift in the basic electronics cooling methods has been sought. This would be a method that not only transports heat from one place to another, but converts heat into a more easily controlled form of energy. An example of a more suitable form of energy is mechanical mo­tion, which can be generated using the Sterling cycle.

Cooling News

New products, services and events from around the industry.