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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Measuring Heat Flux from a Component on a PCB
  • Design Parameters in Immersion Cooling
  • Basic Definition of Thermal Resistance
  • Cooling with Lasers
  • Mobile Device Thermal Management
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Table of Contents - March 2010

Current Issues

March 2010


Critical Heat Flux of Boiling in Microchannels                     

A liquid-cooled microchannel heat sink has been shown to be a very

effective way to remove high heat load. The single-phase liquid cooled

microchannel has been used in many performance-critical applications 

such as laser diodes, RF power amplifiers and CPU cooling systems.


Long Term Thermal Grease Reliability

Among the different TIM options, thermal greases typically offer the

best thermal performance and reduced manufacturing cycle times

though, depending on the application method, assembly can be messy.

Thermal greases have the ability to flow and conform to interfaces,

do not require post-dispense processing such as curing, and have higher

effective thermal conductivity compared to other classes of materials.


Using Silicon Microchannel Heat Sinks for Thermal Management

If high pressures with relatively low flow are allowable in a design,

the microchannel heat sink is a very attractive option that can perform

better than most coldplate designs. Reliability concerns about fittings or

connections are heightened because of the increase in fluid pressure

at the outlet of the pump and inlet of the cold plate.


Tubing Material Selection for Liquid Cooling

Tubing can play a large role in the long term reliability of the solution.

It is important to fully understand tubing characteristics, how they relate

to evaporation, and how the loss of liquid affects the operation of the

system (including pump cavitation and air blockage in a cold plate).


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