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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Measuring Heat Flux from a Component on a PCB
  • Design Parameters in Immersion Cooling
  • Basic Definition of Thermal Resistance
  • Cooling with Lasers
  • Mobile Device Thermal Management
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Table of Contents - April 2010

Current Issues

April 2010



           Jet Impingement Cooling, Part 1: Single Phase

Liquid jet impingement is being actively explored for cooling power electronics components, in particular the insulated gate bipolar transistors (IGBTs) used in the inverters of hybrid automobiles. This article discusses single-phase jet impingement and its effectiveness for cooling electronics components.


AdvancedMCs: Thermal Problems and Cooling Limitations

As these modular systems grow in power due to faster computing and network switching rates, the thermal challenges involving these advanced mezzanine cards are becoming more difficult.  The enclosed and small form factors of these systems, coupled with the high power consumption of many designs, calls for increased attention to their cooling methods. 


Use of Pool Boiling to Thermally Manage High Power Components

Boiling and condensation processes are affected by device geometry, surface roughness, wall superheat, saturation pressure and fluid properties. Understanding the fundamentals of pool boiling and condensation, and the parameters that affect them, will improve the design of thermal management devices.



Adaptive Cooling in Data Centers

With servers increasing in both power and cost, data centers are challenged not only to keep the components cool to prevent their failure, but also to control and ideally decrease the cost of cooling the cabinets. One promising technique is adaptive cooling.


Cooling News

New products, services and events from around the industry.