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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - August 2010

Current Issues

August 2010

Features

 

Low Temperature Refrigeration for Microprocessors

Due to the steady increase of heat capacity in microprocessors, some applications mandate a very low temperature in the cold plate residing on the chip. Microprocessors can improve their performance by lowering their junction temperature.

 

Improving the Performance of Microchannel Heat Sinks

The magic behind microchannel heat sinks is their ability to achieve a high heat transfer coefficient and to create a large surface area. The heat dissipation ability of liquid cooled heat sinks is determined by the heat conduction in solid material and heat convection in the fluid.

 

Designing a Miniature Scale Refrigeration System for Thermal Management

Innovative methods are continuously needed to address the increasing heat dissipation and shrinking size of electronic components. The challenge is to develop efficient and reliable systems on a smaller scale. This article presents some of the work being done in this area.

 

Acoustic Refrigeration

Acoustic refrigeration combines thermodynamics and acoustics to convert sound to heat and vice versa. A thermoacoustic refrigerator amplifies the temperature of sound waves in one area in order to decrease their temperature in another.

 

Cooling News

New products, services and events from around the industry.