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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Measuring Heat Flux from a Component on a PCB
  • Design Parameters in Immersion Cooling
  • Basic Definition of Thermal Resistance
  • Cooling with Lasers
  • Mobile Device Thermal Management
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Table of Contents - November 2010

Current Issues

November 2010


Heat Spreading with Copper, Silicon and Heat Pipes

Heat spreaders are not only chosen for their thermal performance; other design parameters include weight, cost and reliability. This article discusses heat pipe technology, including a discussion of the different types of heat pipes. Then the article provides comparisons between aluminium, silicon, copper and heat pipe-based heat spreaders.


Electrohydrodynamic (EHD) Pumps

EHD is the study of the conversion of electrical energy into kinetic energy, and vice-versa.  Phenomena related to the above include electrophoresis, electrokinesis, dielectrophoresis, electro-osmosis and electrorotation.

At least one EHD pump technology looks promising to have the comparable size, manufacturability and thermal performance to the microchips that it will be cooling.      


                        Multilayer Minichannel Heat Sinks

It was experimentally shown that multilayer minichannel heat sinks have obvious advantages over single-layer heat sinks in both their thermal and hydraulic performance. However there is a limit on the maximum number of layers.            


Heat Sink Manufacturing Technologies

The most common and economical way to cool electronic components is air cooling using heat sinks. Depending on the type of application, lead time, budget and thermal performance required, a wide range of manufacturing methods can be used to produce effective heat sinks.


Cooling News

New products, services and events from around the industry.