Q ATS | Advanced Thermal Solutions, Inc.

  • ATS App.
  • Blog
  • Corporate
  • Newsroom
  • Contacts
  • My Cart
  • Sign in
Quick Heat Sink Search   
Banner for ATS Qpedia

Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
Advance Qpedia Search
Enter Keyword :
Exact phrase Any word








Table of Contents - December 2010

Current Issues

December 2010

Features

Common Cooling Techniques in Thermal Management

Removing heat from an electronic device can be achieved from one or more external surfaces, or through internal means. In addition, several modes of heat transfer can be capitalized on to cool an electronic device that is warmer than desired.

 

 Heat Sink Selection Methodology in Electronics Cooling

To select the best heat sink for your application, it is important to understand the basic heat transfer mechanism used to remove heat flux. The heat transfer theory helps explain practical aspects of how heat sinks work. It also helps to clear up common misconceptions and design mistakes.

 

Heat Transfer Coefficient in High Altitudes

At higher elevations, the pressure and density are low. Fans are basically constant volume sources, implying that the mass flow rate, which is the product of volumetric flow rate and density, reduces at elevations. With the significant reduction of mass flow, a designer must consider different possibilities.       

 

TECs and Micro TECs for Spot Cooling Electronics

The microprocessor evolution should make the jobs of system thermal engineers easier. However the complexity of the processor brings a unique set of cooling challenges. Spot cooling with TECs offers several advantages which must be carefully studied to ensure a successful implementation.

 

Cooling News

New products, services and events from around the industry.