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The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

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Table of Contents - February 2011

Current Issues

February 2011

Features

 

Heat Transfer in Spray Cooling

One of the heat transfer modes with high heat transfer coefficient is spray cooling. Spray cooling has many applications in the industry, such as cooling of electronic components or quenching of metallic products. The spray can be either a single phase liquid jet or mixed and atomized with air. In this article, we present some of the work done by researchers in this area

 

Single Phase Micro Jet Arrayed Impingement

Jet impingement is an attractive cooling mechanism, due to the capability of achieving high heat transfer rates. Over the past 15 years, jet impingement has been explored as a cooling option in microelectronics. This article will discuss the use of single-phase jet impingement using multiple micro jets.

           

Effect of Enhanced Structures on Water Boiling at Sub-Atmospheric Pressure.

Heat pipes and vapor chambers are devices with very high thermal conductance.  Heat pipes and vapor chambers are widely used in thermal management applications for electronic devices, leading to advancements in manufacturing technology and reductions in price. Some of the studies and conclusions of Pal and Joshi and Sloan and Wirtz are explored.

           

Heat Diffusion

One of the topics that has attracted the least attention in thermal management is the diffusion of heat. This article explores temperature distribution, thermal diffusivity and transient responses of temperature for copper and aluminum heat sinks.

 

Cooling News

New products, services and events from around the industry.