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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Enhancing Heat Transfer by Using Single-Phase Oscillating Jets
  • New Design Concepts in 3D Stacked Chips & their Thermal Challenges
  • Graphite TIMs
  • Heat Spreaders
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Table of Contents - March 2011

Current Issues

March 2011

Features

  

Advances in Thermal Interface Materials (TIMs)

Today's  semiconductors, whether discrete power or logic ICs, are characterized by escalating component power dissipations and heat flux, in combination with smaller electronic packages, operating at higher speed and performing more operations.  As a result, they have pushed heat as a concern to the forefront in electronics management. This has also placed the need for advanced thermal interface materials in greater demand than ever before.

 

Parameters Affecting Vapor Chamber Performance

Vapor chambers are flat heat pipes with very high thermal conductance and designed to move the heat from electronics to heat dissipation devices. Vapor chambers are generally used to spread heat from a small size device to a larger size heat sink.  This article compares vapor chambers to copper heat spreaders and evaluates their effectiveness.

 

 

Increasing the Convection Heat Transfer Coefficient by Using Various Piezoelectric Fans Configurations

Natural convection applications range from small electronic devices to LED applications

to multiple kilowatt IGBT heat sinks. All of the above are limited by the relatively small

natural convection heat transfer coefficient. To augment or improve the convection heat

transfer coefficient without the use of fans, synthetic jets and piezoelectric fans are two

methods that can be utilized. This article will discuss an experiment to demonstrate the

benefit of a single piezoelectric fan. Thereafter, the performance of two piezoelectric

fans in different configurations will also be investigated.

 

           

Sub-Ambient Cooling of Microprocessors

Dissipation of heat generated during microprocessor operation is a fundamental challenge in the design of electronics packaging. The device sizes are shrinking, but the power is going up. This has created new challenges to prevent microprocessors from overheating. The spreading.

resistance, as a result of shrinking die, compared to the package size is making matters worse.  This article examines the issues in sub-ambient cooling.

 

Cooling News

New products, services and events from around the industry.