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The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

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Table of Contents - April 2011

Current Issues

April 2011


Application Of Mist Cooling For Thermal Management

One of the more promising techniques for removing high heat fluxes is mist cooling.  Yet, even though there are numerous studies on jet impingement, mist or spray cooling specially for confined flows has not been studied extensively.



Thermal Management In Automobiles

It is common knowledge that electronics in automobiles has become more and more sophisticated and that the power consumption only seems to increase. All of these considerations highlight the importance of analyzing thermal management for the automobile as a system rather than as independent components.



Piezoelectric Fans And Their Application In Electronics Cooling

Piezoelectric fans seem to represent an example of research and development that has culminated in a product that is deceptively simple.  Although piezoelectric technology is capable of producing rotary motion, the fans operate quite differently from rotary fans, as they generate air flow with vibrating cantilevers instead of spinning blades.



Thermal Management Strategies For High Heat Flux Electronic Devices

With the steady increase of functionality and performance of electronic devices and the escalating demand for miniaturizing device dimensions, it is not surprising to see the continued increase of heat flux dissipation of modern electronic devices, especially the microprocessors, microcontrollers  and DSPs. In the foreseeable future, finding the cost-effective cooling solution for high heat flux electronic devices is the Holy Grail for mechanical and thermal engineers.



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