ATCA Standards For Thermo-Mechanical Considerations
This is a basic overview of ATCA and provides a summary of some off the essential standards as well. It begins with a brief review of PICMG’s introduction of ATCA in 2002, and then goes on to discuss the key standards and/or requisite dimensions for boards, blades, shelf, subrack and chassis. In addition, there is a presentation of the typical guidelines for air temperature and pressure drops.
Miniature Refrigerator For A Laptop
As integrated circuits (ICs) have to provide increased functionality and computational power through a greater number of transistors in smaller and smaller packages, the removal of heat dissipated by these electronic chips has become a serious challenge in the design of portable and other space-limited electronic devices. This article explores some of the cooling options.
Thermal Simulation and Management of a 3D Stacked Chip
As new generations of electronic devices are required for more functions, connectivity, versatility, and less weight, their sizes keep diminishing. These put enormous pressure on the chip design, device package and thermal management of such devices.
JEDEC: Review Of Standards On Compact Thermal Modeling
This article focuses on the thermal management of electronics and the JEDEC standard JC-15: “Thermal Characterization Techniques for Semiconductor Packages”. The scope of JC-15 includes the standardization of thermal characterization techniques, both testing (JED51) and modeling (JESD15) for electronic packages.
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