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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Measuring Heat Flux from a Component on a PCB
  • Design Parameters in Immersion Cooling
  • Basic Definition of Thermal Resistance
  • Cooling with Lasers
  • Mobile Device Thermal Management
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Table of Contents - August 2011

Current Issues

August 2011


Jet Array Impingement Cooling

As researchers seek ways to increase the heat transfer from high-powered electronics, they find that every solution has its own set of problems. One promising cooling technology is the use of jet impingement, which directs a small, but high velocity flow onto an impingement surface. The problem is that jets only cool a very small area.  This article examines how researchers identify potential solutions.


Application of Metal Foams in Heat Sinks and Heat Exchangers

With the increasing power density and size of electronic components, the existing heat sink designs are reaching their plateau, necessitating a different heat sink design or high performance heat exchangers and cold plates using liquid. The application of reticulated metal foams in heat sinks and heat exchangers is one such attempt in designing such high performance heat exchangers.  Find out more about how they perform.



The Total Cost of Ownership of Data Centers

The cost to build and operate a modern data center keeps increasing as the data centers become bigger and more sophisticated. For data center investors, and companies which intend to use the data center, predicting and measuring total cost of ownership (TCO) for constructing and operating a data center is an essential task for deciding to build or rent a data center. Learn for yourself the key factors that give the true TCO in this article.


Passive or Active Cooling: A Model for Fast Thermal Exploration of

Electronic Product Concepts

In this paper, the authors propose to develop a model that can be used as a rule-of-thumb for fast thermal exploration of electronic products.  The primary aim is to provide a model for first order exploration of the choice between passive or active cooling. The secondary aim is to give design engineers a means for communicating with the electronics engineer.


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