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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Measuring Heat Flux from a Component on a PCB
  • Design Parameters in Immersion Cooling
  • Basic Definition of Thermal Resistance
  • Cooling with Lasers
  • Mobile Device Thermal Management
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Table of Contents - September 2011

Current Issues

September 2011




CFD Simulation of Jet Impingement 

Jet impingement is one of the most efficient solutions for cooling hot electronic devices, as it can create a very high heat transfer rate on an impacting surface. As the power density of modern chips keeps increasing, using jets as a thermal management method shows great potential, even though its implementation is more complicated than forced air and liquid cooling.


Getting the Most Out of Your Heat Sink Design: An Overview of the Parameters Which Influence Your Design

The design of a heat sink needs to be based upon a holistic approach to derive the most satisfactory result possible. Heat sinks are widely used as the primary means of heat transfer from a component to the environmental air. It is, relatively, one of the cheapest cooling methods available on the market, has a high reliability and can be easy to implement. In the past, the heat flux limit achievable with liquid cooled system could be achieved with air cooled systems though advancements in the design of heat sinks


Spray Cooling Electronics in a 1-U Chassis

When it comes to designing electronics for a Navy submarine, efficient use of space and power are high on a long list of requirements. Electronics and their cooling systems must also pass tough environmental tests, including operation in temperature extremes, at different pressures and humidity levels, and survivability through shock, vibration, and temperature swings. On top of that, electronics racks in submarines are not as deep as standard racks.


Transient Response of a PCM with Embedded Graphite Nanofibers

In electronics cooling, there are several options when choosing how to leverage the latent heat characteristics of a phase change material.  Reliability issues have forced thermal engineers to suspend the pursuit of active cooling options such as heat pipes, and persist toward innovative methods in passive cooling solutions.  Great strides have been made in the application of phase change materials embedded with graphite nanofibers to improve the transient thermal response. 


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