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Download the latest issue of Qpedia. Key topics featured in this issue are:

  • Conduction-Convection Cooling Solution for 3D Stacked Electronics
  • Thermal Characteristics of Wickless Vapor Chambers
  • Phase Change Materials
  • Cooling 3D Stacked Die Packages
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Table of Contents - October 2011

Current Issues

October 2011

Features

 

How to Compare the Thermal Performance of Different Heat Sinks

With so many heat sinks and so many application variables, choosing the proper heat sink is one of te board designer’s greatest challenges.  This article presents some helpful methods to more accurately rank heat sink performance.  As is common to the electronics industry, the focus shall be on medium powered discrete electronic components.

 

Synthetic Air Jet for Electronics Cooling

The synthetic jet is a very good way to enhance the heat transfer on the impingement surface. This article explores the experimental tests performed by some of the leading researchers in the field:  Amitay, McGuinn, Murray, O’Donovan, Pavlova, Persoons and Valiorgue, who studied synthetic jets under various conditions.   

 

Waste Heat Recovery of Electronic Equipment

With the rapid increase of power dissipation in electronics’ components, the energy needs for cooling are also increasing at a rapid pace.  During the process of activating and cooling components, heat is generated and dumped in the atmosphere.  This wasted energy on a global scale is huge.

 

Effect of Cross-Flow on Straight and Inclined Jets

Jet impingement is a very effective solution for cooling electronic devices, because it can create a high heat transfer rate on impacting a surface.  As the power density of modern chips keeps increasing, using fluid jets as a thermal management methods shows great potential.

 

Cooling News

New products, services and events from around the industry.