Miniature-Scale Refrigeration for Thermal Management
Processor frequencies are increasing along with board densities, while spatial constraints are remaining the same, or shrinking. Refrigeration cooling can emerge as a practical solution to advanced electronic cooling challenges. Refinement of vapor compression cooling techniques are sure to unlock a new era of electronics where the use of ultra-high performance semiconductor devices are designed specifically for low temperature operation and are readily available.
LED Heat Transfer and Cooling Technology Options
LED lighting is one of the fastest growing market sectors across the globe. The challenge that a designer or producer of such product has is the alignment of the cooling system/solution with the deployment-site requirements and its marketplace acceptance. In addition to packaging issues, this article explores the role of junction temperature on light output and useful life.
Cooling High Power Electronics with Microchannels
In recent years, as computing power densities have continued to increase, it has come to the point where the traditional air cooling solution is becoming less and less able to keep up with today’s power dissipation requirements. No single technology has yet been declared the frontrunner in the race to keep the next generation of computers cool, but liquid cooling and the use of microstructures in heat exchangers have been the subject of much exploration.
Understanding Cold Plate Manufacturing for Deployment in Electronics Equipment
The most important rule in the thermal management of electronics devices is to design cooling systems to maintain the device junction temperature below a set limit called maximum junction temperature. The most common and economical method for cooling devices is air cooling. However, to deal with increasingly amplified heat rejection issues, more and more engineers are turning to liquid cooling.
New products, services and events from around the industry