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The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

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Table of Contents - December 2011

Current Issues

December 2011

Features

 

Comparison of Heat Pipes Under Normal and Low Gravity Conditions

The heat pipe is a self-driven, two-phase heat transfer device with a very high  thermal conductance.  It is widely used in aerospace applications, military devices, temperature control systems and personal computers.  This article covers several experimental studies which analyze their performance under a variety of earth (normal gravity) and aerospace conditions (low gravity).

 

 

Heat Transfer Mechanism in LED Packages

With the rapid replacement of incandescent light bulbs by Light-Emitting Diodes (LEDs), the thermal management of LEDs has become even a greater necessity.  Prior to devising cooling schemes to keep the LEDs running cool, understanding the fundamental heat transfer mechanism in an LED package is a must.  Tis article discuss a fundamental issue of the underlying heat transfer mechanism in LEDs.

 

 

A Heat Sink with an Integrated Heat Pipe

An unusual heat sink was built recently by researchers seeking to create a cooling solution for high power applications.  The researchers’ approach was to use heat pipe technology, but apply it in a radically different way, in order to optimize performance and minimize weight and size.  This article explores the pros and cons of this heat pipe-heat sink.

 

 

Common Materials Used in Thermal Management

There are several tradeoffs to the advanced materials used in lowering junction temperatures, weight and size, and increasing performance/reliability, and dimensional stability available in the market place today.  Designers need to utilize every aspect of the design to transfer heat in any way possible.  This article explores some of the challenges entailed in designing solutions.

 

Cooling News

New products, services and events from around the industry.