Qpedia Thermal eMagazine Articles Now Available in Hardcover Book

Advanced Thermal Solutions, Inc. (ATS) has published Qpedia Thermal eMagazine, Volume 1, Issues 1-12, a hardbound, full-color book that compiles all of the electronics thermal management articles that first appeared in its online emagazine, Qpedia. In all, the book contains 46 technically comprehensive articles offering expert-level coverage on a wide range of heat management issues that impact virtually all of today’s electronic devices. Topics range from spot cooling hot areas on silicon dies to enhancing airflow over PCBs and inside chassis and cabinets.

Articles in the Qpedia Thermal eMagazine book provide object analyses of different thermal management techniques, including jet impingement, thermoelectric cooling and micro TECs, heat pipes, cold plates, vapor chambers, liquid cooling, immersion cooling and air cooling.

Other articles explain the function and use of devices used for thermal analysis, design and applications. These include thermocouples, sensors, hot-wire anemometry and bench-top visualization techniques. Computational Fluid Dynamics (CFD) is also covered.

The book provides useful explanations of pressure drop, air flow measurement, thermal resistance and radiation heat transfer. Each article features helpful illustrations, clear definitions and important thermal calculations and formulas.

All articles are written and edited at the engineer-level by the thermal and mechanical engineers from Advanced Thermal Solutions, including Kaveh Azar, Ph.D., the company’s president and CEO; and Bahman Tavassoli, Ph.D., its chief technologist. Both Azar and Tavassoli are internationally recognized experts in the thermal management of electronics.

Qpedia Thermal eMagazine, Volume 1, Issues 1-12, ISBN-978-0-615-23660-5, the hardbound, full color book can be ordered for $94.95 (USD).

Note: All orders are shipped FedEx 2-Day Priority. A $15.00 shipping and handling fee applies to all orders.