As many of our customer’s know, ATS is a big believer in phase change thermal interface material.  Certainly every type of thermal interface material has it’s correct place in a design, from thermal tape to grease, but we feel that phase change material can do a terrific job technically and economically. In fact, we invented maxiGRIP to allow for phase change material to be better used. Bergquist now has released a new family of phase change material named, “Hi-Flow 330P“.
Hi-Flow 330P features a thermal impedance of only 0.18°C-in2/W (@25 psi). It also features one dry side and one naturally tacky side to accommodate efficient handling and dispensing.  Bergquist’s new material is electrically insulating, with its polyimide reinforcing film providing dielectric strength higher than 5 kV and high resistance to cut-through. Learn more by visiting the 330P web page, “Hi-Flow 330P”
Just a note on applying steady, consistant PSI. The best way to do that is via a metal spring clip, and maxiGRIP frame clip which deliver a steady, consistent force to apply the heat sink to a given chip. Click on this presentation at Digi-Key to learn more facts as to why.