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ATS-725
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Summary Datasheet
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New heat sink solution specially designed for cooling Cavium Networks’ widely-used OCTEON Plus CN56XX and OCTEON CN38XX and CN36XX multi-core MIPS64 processors.
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ATS-691
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Summary Datasheet
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New heat sink solution specially designed for cooling Cavium Networks’ widely-used OCTEON Plus CN56XX and OCTEON CN38XX and CN36XX multi-core MIPS64 processors.
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ATS Heat Sink Catalog
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Summary Datasheet
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Advanced Thermal Solutions, Inc. (ATS) has published a new Heat Sink Catalog that provides dimensions, part numbers, performance data, and pricing for more than 350 heat sinks available for overnight delivery from the Digi-Key catalog and website.
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ATS - Freescale Heat Sink Solutions Quick Reference Guide
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Summary Datasheet
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Heat sink and attachment solutions for Freescale processors.
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ATS-OSRAM DRAGONstick Heat Sink Solutions
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Summary Datasheet
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Advanced Thermal Solutions, Inc. worked with OSRAM engineers to design and manufacture a range of custom Heat Sink solutions, with exceptional cooling properties, for OSRAM’s DRAGONstick® linear LED lighting products. This chart will help you determine the optimum ATS solution for your OSRAM DRAGONstick® lighting application.
The ATS-486, ATS-503 and ATS-504 are maxiFLOW™ heat sinks which feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling, particularly when air flow is limited. The sinks are fabricated from extruded aluminum which enhances their heat transfer properties from base to fins, while minimizing their weight and cost.
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Cooling Solution for Mindspeed 21050
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Summary Datasheet
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Application notes on thermal performance for the Mindspeed M21050 is a high-performance duplex quad (octal) multi-rate clock and data recovery (CDR) array, using Advanced Thermal Solution's ATS0100010010-SF-1I Straight Fin Heat Sink
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ATS-374 "Fairbanks"
[
Summary Datasheet
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Cooling solution for Freescale MPC85XX application featuring ATS' maxiFLOW technology for superior cooling and, maxiGRIP attachment which does not require holes in the board
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maxiGRIP Shock & Vibration Test Report- NTS Certification
[
Summary Datasheet
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maxiGRIP sink attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components, passes Mil-STD-810 Shock Testing and Unpackaged Drop Testing.
Shock and vibration testing was performed and certified by National Technical Systems, Inc. (NTS), a leading provider of engineering services to the defense, aerospace, telecommunications, automotive and high technology markets.
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ATS 405 "Juneau"
[
Summary Datasheet
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Active cooling solution for Freescale Semiconductor's MPC 8641D dual-core processors
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ATS 474 "Anchorage"
[
Summary Datasheet
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Passive cooling solution for Freescale Semiconductor's MPC 8641D dual-core processor.
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ATS-EX84 "Pelican"
[
Summary Datasheet
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Heat Sink Cools Low-Power 25mm x25mm Processors
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maxiGRIP Heat Sink Attachment Solutions
[
Summary Datasheet
]
maxiGRIP is a patent-pending frame clip and metal spring clip to secure heat sinks to IC’s. Advanced Thermal Solutions’ exclusive maxiGRIP heat sink and clip assembly allows for quick and easy installation and removal whenever it is needed. Due to this unique design maxiGRIP can provide superb cooling, with a wide array of heat sinks, without the hassle of cracking the dies or ripping the component from the PCB during installation.
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Candlestick Sensor
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Summary Datasheet
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With a robust and flexible design, the Candlestick Sensor can measure both temperature and velocity.
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HFC 100 Heat Flux Controller
[
Summary Datasheet
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A high heat flux chip simulator capable of measuring and
controlling the amount of heat in a resistive element.
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ATVS 2020
[
Summary Datasheet
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Hot wire anemometer system for measuring air velocity and temperature
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ATVS-NxT
[
Summary Datasheet
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Thermal Measurement on the LAN or WWW - Fully Portable Automatic Velocity & Temperature Scanner
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BWT-100
[
Summary Datasheet
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Benchtop Wind Tunnel
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ATVS 2000
[
Summary Datasheet
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Automatic Temperature and Velocity Scanner
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BWT-104™
[
Summary Datasheet
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The BWT-104™ is a research quality, open loop, benchtop wind tunnel for thermal characterization of components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates.
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eATVS-4 and eATVS-8
[
Summary Datasheet
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Automatic Temperature and Velocity Scanner
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blackDiamond
[
Summary Datasheet
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The passive cooling solution for Intel's Xeon processor
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BlueICE
[
Summary Datasheet
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Low Profile - High Performance - Low Velocity
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BGA Cooling Solutions
[
Summary Datasheet
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High Performance, Low Profile & Lightweight
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CWT-100
[
Summary Datasheet
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Controlled Wind Tunnel
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CWT-106
[
Summary Datasheet
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Innovative Construction - Research Quality Wind Tunnels
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CWT-108
[
Summary Datasheet
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Open Loop Research Wind Tunnel
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CLWT-100
[
Summary Datasheet
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Closed Loop Wind Tunnel
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CWT-107
[
Summary Datasheet
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Unique Open Loop Wind Tunnel for Thermal Characterization of Components, Boards and Heat Sinks.
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CWT-PCB
[
Summary Datasheet
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Controlled Wind Tunnel
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Cross Cut Heatsinks
[
Summary Datasheet
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Heatsinks
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Heat Sink Solutions
[
Summary Datasheet
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The Only Heat Sink for Tough to Cool Electronics
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Heat Sink Comparison
[
Summary Datasheet
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Measuring the Impact of Higher Thermal Resistance
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ISD
[
Summary Datasheet
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Temperature and Velocity Management with Analog Output
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ISD-232
[
Summary Datasheet
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Temperature and Velocity Measurement with Digital Output
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PCS-1000
[
Summary Datasheet
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Programmable Control System
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powerICE
[
Summary Datasheet
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Low Profile - High Performance - Low Velocity
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MaxiFLOW
[
Summary Datasheet
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Ultra Performance Extrusion
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Pin Fin
[
Summary Datasheet
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Extrusion Heat Sinks
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Sensors
[
Summary Datasheet
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ATVS and eATVS Family of Sensors
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Sensors
[
Summary Datasheet
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ATVS and eATVS Family of Sensors
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Straight Fin
[
Summary Datasheet
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High Performance Extrusion
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thermKIT
[
Summary Datasheet
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Liquid Crystal Thermography Kit
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thermVIEW
[
Summary Datasheet
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Liquid Crystal Thermographic Analysis Tool
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Thermal Consulting Services
[
Summary Datasheet
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The Complete Solutions Provider
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Wind Tunnels
[
Summary Datasheet
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For Thermal Characterization
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WTC-100
[
Summary Datasheet
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Wind Tunnel Controller
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