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QPEDIA

The Newsletter for the Thermal Management of Electronics

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Main Issue
August 2008 (Download complete issue)

	Articles:
	Pumped Two-Phase Loop for Electronics Cooling
	How Heat Sink Height Affects Its Thermal Resistance
	Decreasing Thermal Contact Resistance by Using Interface Materials
	The Effect of Thermal Entry Regions on Heat Transfer

Main Issue
July 2008 (Download complete issue)

	Articles:
	Vapor Chamber and Solid Material as a Base for High Power Devices
	Lumped System Heat Transfer Analysis
	Heat Transfer Correlations in Thermal Management - Part 2
	Heat Sink Attachment Options

Main Issue
June 2008 (Download complete issue)

	Articles:
	Liquid Metal Cooling Systems
	Heat Sink Thermal Resistance Changes with Length and Width
	Radiation Heat Transfer and Surface Area Treatments
	Using Fan Trays in Electronic Systems

Main Issue
May 2008 (Download complete issue)

	Articles:
	Understanding Loop Heat Pipes
	How the maxiGRIP System Impacts Component Mechanical Behavior
	Heat Transfer Correlations in Thermal Management
	CFD Packages in Electronics Thermal Analysis - Part 2: System Modeling

Main Issue
April 2008 (Download complete issue)

	Articles:
	Using Thermosiphons in Electronics Cooling
	Integral Modeling of a Component
	Air Cooling Studies in an ATCA Chassis
	How Interface Materials are Tested

Main Issue
March 2008 (Download complete issue)

	Articles:
	Cryogenics Cooling for the Thermal Management of High Power Electronics
	CFD Packages in Electronics Thermal Analysis - Part 1: General Modeling
	A First Order Thermal Model of a Telecom Chassis
	What is Turbulence?

Main Issue
February 2008 (Download complete issue)

	Articles:
	Refrigeration Cooling for Electronics Thermal Management
	Fan Curves and Laws
	Thermal Coupling Between Components and Electronic Systems
	Discharge Coefficient in Flow Calculations and Measurement

Main Issue
January 2008 (Download complete issue)

	Articles:
	Thermal Management by Immersion Cooling
	JEDEC-Driven Resistances
	Compact Heat Exchangers for Electronics Cooling
	Cooling High Power LEDs

Main Issue
December 2007 (Download complete issue)

	Articles:
	Hybrid Cooling for Electronic Systems
	Device Thermal Coupling on a PCB
	Understanding Hot-Wire Anemometry
	Flow and Heat Transfer Correlations for Mini and Microchannels

Main Issue
November 2007 (Download complete issue)

	Articles:
	Thermal Characteristics of Liquid Coolants for Liquid Loop Cooling
	Human and Technical Factors in Upfront CFD Success
	Using Flow Visualization for PCB Thermal Design and Optimization
	Hydraulic Diameter: Definition and Role in Electronics Cooling
	Cooling News

Main Issue
October 2007 (Download complete issue)

	Articles:
	Closed Loop Liquid Cooling for High Power Electronics
	ATCA and MicroTCA Chassis; Their Roles and Uses
	Thermal Coupling with Different Modes of Heat Transfer from a Single Device
	Understanding Radiation Heat Transfer

Main Issue
September 2007 (Download complete issue)

	Articles:
	Vapor Chambers and Their Use in Thermal Management
	Liquid Cooling - Is Hydrophobia Still an Issue?
	RoHS and Electronics Cooling
	Hydraulic Resistance and its Role in Electronics Cooling
	Cooling News

Main Issue
August 2007 (Download complete issue)

	Articles:
	Micro TECs for Spot Cooling of High Power Devices
	The Effect of Compact PCB Layout on Thermal Management
	Air Flow Measurement in Electronic Systems
	Spreading Thermal Resistance; Its Definition and Control

Main Issue
July 2007 (Download complete issue)

	Articles:
	Experimental Study on a Hybrid Liquid/Air Cooling System
	Heat Pipes: Heat Super Conductors
	How System Flow Affects Fan Sink Performance
	Cooling News
	Sensors for Temperature Measurement, and Their Application

Main Issue
June 2007 (Download complete issue)

	Articles:
	Wind Driven Flow Using Electrodes in Thermal Management
	Understanding JEDEC Integrated Circuit Thermal Test Standards
	Accurate Temperature Measurement
	Thermal Conductivity for Effective Electronics Cooling
	Cooling News

Main Issue
May 2007 (Download complete issue)

	Articles:
	Thermal Management and Packaging Challenges of High Power Devices
	How to Select a Thermoelectric Cooler
	Why Use Research Quality Instruments?
	Heat Exchangers: Theory and Selection
	Cooling News

Main Issue
April 2007 (Download complete issue)

	Articles:
	Chip-level Cooling with Electrowetting and Microchannels
	How Thermoelectric Coolers Work
	Cold Plate Design for Electronic Systems
	Understanding Heat Transfer Coefficient
	Cooling News

Main Issue
March 2007 (Download complete issue)

	Articles:
	Cooling News
	Correlation of Pressure Drop in Electronics Packaging
	Microchannel Concepts and Recent Advances
	Selecting a Fan
	Understanding Thermal Conductivity

Main Issue
February 2007 (Download complete issue)

	Articles:
	Cooling News
	Future Cooling: Jet Impingement Cooling
	Thermal Analysis: Pressure Drop Calculations in a Chassis
	Thermal Fundamentals: Thermocouples; What They Are and How They Work
	Thermal Minutes: Thermal Management of Telecom and Datacomm Equipment