- Video: Heat Sink Attachments
- superGRIP Installation/Removal Guide
- superGRIP Clearance Guidelines
- superGRIP Datasheet
- maxiGRIP Installation/Removal Guide
- maxiGRIP Clearance Guidelines
- maxiGRIP Datasheet
Best Heat Sink Attachment Technology for industry standard heat sinks on the market!
clipKIT™ is a line of patented, reliable heat sink attachment assemblies featuring the widely used maxiGRIP™ and superGRIP™ frame clip and spring clip. clipKIT™ is available for 15 – 45mm component packages and is designed for industry standard heat sinks that have a base thickness of 1.75 to 4mm.
Instead of relying on thermal tape or epoxy, which can damage the board or component during rework, the reliable clip attachment system provides a secure hold without the risk of damaging the component or PCB, saving time and cost. The ultra-thin plastic frame clip and stainless steel spring clip are corrosion-resistant, flame retardant and pass Telcordia shock and vibration standards, ensuring the heat sink will securely stay in place on the component in harsh conditions. clipKIT™ attachments eliminate the need to drill holes in a PCB, saving additional board and rework costs. The thin frame clip occupies minimal space around the components perimeter, compared to push pin attachments or stand-off hardware which leaves little space on already overcrowded PCBs. The two-part attachment system provides a uniform force which enhancing heat transfer and improves TIM performance by up to 20%. Click Here for datasheet.
- Patented maxiGRIP™ and superGRIP™ technology available for straight fin, slant fin, cross cut, and pin fin heat sinks
- To be used with heat sinks that have a 1.75 mm to 4 mm base thickness
- Plastic frame and stainless steel spring clips available for 15 mm to 45 mm components
- Secure heat sink attachment system passes Telecordia shock and vibration standards
- Attachment force improves TIM performance by up to 20%
- Eliminates the need to drill holes in a PCB and allows the heat sink to be detached and reattached without damaging the component