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ATS-TI1OP-519-C1-R2 36.0 x 78.0 x 35.6  mm   BGA Heat Sink - High Performance Device Specific -  TI
*Image above is for illustration purpose only..
36.0 x 78.0 x 35.6 mm  BGA Heat Sink - High Performance Device Specific - TI
ATS Part#: ATS-TI1OP-519-C1-R2
Description: 36.0 x 78.0 x 35.6 mm  BGA Heat Sink - High Performance Device Specific - TI
Component Specific: N/A
Heat Sink Type: TI
Heat Sink Attachment: Heat Sinks Come with Two Threaded Mounting Holes
Installation Guide: N/A
Thermal Performance: See detail
Mechanical Drawing: See detail
  • Designed specifically for TI’s Audio Evaluation Module #TAS5622DDVEVM
  • Heat sinks come with 2 4-40 taped threaded holes
  • Optimized for natural convection air cooling
  • Black anodized for maximum heat dissipation
Product Details
Part Number Length
(mm)
Width
(mm)
Height
(mm)
Fin Tip to Fin Tip
(mm)
TIM FINISH Data Sheet RoHS & REACH
ATS-TI1OP-519-C1-R2 36.0 78.0 35.6 N/A BLACK-ANODIZED download data sheet

Thermal Performance
Schematic Image AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
100 0.5 N/A N/A
200 1.0 N/A N/A
300 1.5 N/A N/A
400 2.0 N/A N/A
500 2.5 N/A N/A
600 3.0 N/A N/A
700 3.5 N/A N/A
800 4.0 N/A N/A
ATS-TI1OP-519-C1-R2
36.0 x 78.0 x 35.6 mm  BGA Heat Sink - High Performance Device Specific - TI
download data sheet
ATS-TI1OP-519-C1-R2
Mechanical Drawing - FUSED MODEL (used for Form and Fit use)
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Installation & Removal
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Clearance Guidelines
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Installation Guidelines
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Clearance Guidelines
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RoHS
Obtain RoHS Certificate
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