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36.0 x 78.0 x 35.6 mm
BGA Heat Sink - High Performance
Device Specific - TI
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36.0 x 78.0 x 35.6 mm BGA Heat Sink - High Performance Device Specific - TI
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ATS Part#: |
ATS-TI1OP-519-C1-R2 |
Description: |
36.0 x 78.0 x 35.6 mm BGA Heat Sink - High Performance Device Specific - TI |
Component Specific: |
N/A |
Heat Sink Type: |
TI |
Heat Sink Attachment: |
Heat Sinks Come with Two Threaded Mounting Holes |
Installation Guide: |
N/A |
Thermal Performance: |
See detail |
Mechanical Drawing: |
See detail |
|
- Designed specifically for TI’s Audio Evaluation Module #TAS5622DDVEVM
- Heat sinks come with 2 4-40 taped threaded holes
- Optimized for natural convection air cooling
- Black anodized for maximum heat dissipation
Product Details
Part Number |
Length
(mm) |
Width
(mm) |
Height
(mm) |
Fin Tip to Fin Tip
(mm)
|
TIM |
FINISH |
Data Sheet |
RoHS & REACH |
ATS-TI1OP-519-C1-R2 |
36.0 |
78.0 |
35.6 |
N/A |
|
BLACK-ANODIZED |
|
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