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ATS-NVA-3275-C1-R0 100.0 x 87.0 x 16.0  mm   BGA Heat Sink - High Performance Device Specific - NVIDIA
*Image above is for illustration purpose only..
100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
ATS Part#: ATS-NVA-3275-C1-R0
Description: 100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
Component Specific: NVIDIA® Jetson AGX Xavier™ and AGX Orin™
Heat Sink Type: Active heat sink (fan not included)
Heat Sink Attachment: Stainless steel screw
Installation Guide: N/A
Thermal Performance: See detail
Mechanical Drawing: See detail

NVIDIA Heat Sinks Features & Benefits

  • Designed to fit the NVIDIA® Jetson AGX Xavier™ and AGX Orin™ modules.
  • Stainless steel screw fan attachment ensures dependable long-term fan to heat sink assembly
  • Fan assembly hole pattern is 71.5 mm C-C (center to center).
  • Included fan assembly kit: ATS-HK507-R0 (PPH, 4-40 X 1 3/8” screws with standoffs)
  • Fan not included - ATS recommended fans listed below
  • Provided with pre-assembled Thermal Interface Material (TIM) on base
  • Mounting Screws - M3x0.5 (3mm standard) - Thread length: 30
  • Recommended through hole size in PCB is 3.40 mm
Recommended Fans
Part NumberManufacturerL
(mm)
W
(mm)
H
(mm)
Voltage
(VDC)
Air Flow
(CFM)
Static Pressure
(Pa)
Lead Wire
AFB0812VHD-ADelta8080201263.5 (1.78m³/min)98.1Black (-), Red (+)
9GA0812P6G001Sanyo Denki8080201260.8 (1.70m³/min)109.6Red (+) Yellow (Sensor)
B (-), R (+), Y (Sensor)
Product Details
Part Number Lifecycle Status Length
(mm)
Width
(mm)
Height
(mm)
Fin Tip to Fin Tip
(mm)
TIM FINISH Data Sheet RoHS & REACH
ATS-NVA-3275-C1-R0 ACTIVE 100.0 87.0 16.0 N/A Chomerics T412 Black Anodized download data sheet

Thermal Performance
Schematic Image AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip.
100 0.5 N/A N/A
200 1.0 0.2 N/A
300 1.5 N/A N/A
400 2.0 N/A N/A
500 2.5 N/A N/A
600 3.0 N/A N/A
700 3.5 N/A N/A
800 4.0 N/A N/A
  • Fan not included. Fan type is specific to individual customer requirements and needs to be independently sourced.
  • Dimensions A and B refer to heat sink size.
  • Dimension C is the heat sink height from the bottom of the base to the top of the fin field.
  • Dimensions D and E refer to the mounting hole pattern C-C (center to center)
  • Thermal performance data are provided for reference only. Actual performance may vary by application.
  • ATS reserves the right to update or change its products without notice to improve the design or performance
  • ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.
  • Contact ATS to learn about custom options available.

ATS-NVA-3275-C1-R0   (Data Sheet)
100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
download data sheet
ATS-NVA-3275-C1-R0
Mechanical Drawing - FUSED MODEL (used for Form and Fit use)
download fused Model for Form and Fit use
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RoHS
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