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ATS-NVA-3281-C1-R0 63.0 x 40.0 x 8.0  mm   BGA Heat Sink - High Performance Device Specific - NVIDIA
*Image above is for illustration purpose only..
63.0 x 40.0 x 8.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
ATS Part#: ATS-NVA-3281-C1-R0
Description: 63.0 x 40.0 x 8.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
Component Specific: NVIDIA Jetson Orin Nano / Jetson Orin NX
Heat Sink Type: Active heat sink (fan not included)
Heat Sink Attachment: Leaf spring with screws
Installation Guide: N/A
Thermal Performance: See detail
Mechanical Drawing: See detail

NVIDIA Heat Sinks Features & Benefits

  • Designed to fit the NVIDIA® Jetson Orin Nano™ and Jetson Orin™ NX modules.
  • Leaf spring with screws for mounting heat sink
  • Included mounting hardware kit: ATS-HK510-R0
    • (leaf spring with M2 x 0.4mm shoulder screws - drive: Torx T8)
  • Fan assembly hole pattern is 32.0mm C-C (center to center)
  • Included fan attachment kit: ATS-HK509-R0 (M3 x 18mm screws)
  • Fan not included - ATS recommended fans listed below
  • Provided with pre-assembled Thermal Interface Material (TIM) on base
  • Recommended through hole size in PCB is 3.20 mm (PCB thickness: 1.2 mm)
Recommended Fans
Part NumberManufacturerL
Air Flow
Static Pressure
Lead Wire
AFB0405HHA-ADelta40401058.2 (0.230m³/min)47.3Black (-), Red (+)
109P0412H901Sanyo Denki404010125.3 (0.148m³/min)41.1B (-), R (+), Y (Sensor)
Product Details
Part Number Lifecycle Status Length
Fin Tip to Fin Tip
ATS-NVA-3281-C1-R0 ACTIVE 63.0 40.0 8.0 N/A Chomerics T766 Black Anodized download data sheet

Thermal Performance
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip.
100 0.5 N/A N/A
200 1.0 1.6 N/A
300 1.5 N/A N/A
400 2.0 N/A N/A
500 2.5 N/A N/A
600 3.0 N/A N/A
700 3.5 N/A N/A
800 4.0 N/A N/A
  • Fan not included. Fan type is specific to individual customer requirements and needs to be independently sourced.
  • Dimensions A and B refer to heat sink size.
  • Dimension C is the heat sink height from the bottom of the base to the top of the fin field.
  • Dimensions D and E refer to the mounting hole pattern C-C (center to center)
  • Thermal performance data are provided for reference only. Actual performance may vary by application.
  • ATS reserves the right to update or change its products without notice to improve the design or performance
  • ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.
  • Contact ATS to learn about custom options available.

ATS-NVA-3281-C1-R0   (Data Sheet)
63.0 x 40.0 x 8.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
download data sheet
Mechanical Drawing - FUSED MODEL (used for Form and Fit use)
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Installation & Removal
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Clearance Guidelines
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Installation Guidelines
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Clearance Guidelines
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Obtain RoHS Certificate
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